{
  "slug": "e2",
  "term": "E2",
  "aliases": [
    "EDSFF E2"
  ],
  "definition": "E2 is an EDSFF device form factor designed for vertical installation in 2U systems, with mechanical requirements defined by SFF-TA-1042.",
  "note": "Published Rev 1.0, dated 16 June 2025, describes a design goal of accommodating at least 64 NAND packages. This is not a required installed package count or a byte-capacity guarantee. [c1]\n\nThe enclosure uses the SFF-TA-1002 card-edge interface and SFF-TA-1009 signal assignments. A latch or front plate can extend beyond the documented enclosure dimensions, so bay qualification must include those parts. [c1]\n\nThe specification distinguishes 25 W initial slot power from the connector-derived 79.2 W ceiling. Host and device operating conditions further limit sustained power; cooling must satisfy the applicable host requirements. [c1]",
  "status": "unknown",
  "advantages": [],
  "limitations": [],
  "related": [
    "edsff",
    "e1-l",
    "e1-s",
    "e3-s",
    "flash-module",
    "nand-flash"
  ],
  "supersedes": [],
  "supersededBy": [],
  "firstSeen": null,
  "lastSeen": null,
  "citations": [
    {
      "id": "c1",
      "title": "SNIA SFF-TA-1042 Rev 1.0 (16 June 2025): abstract, sections 1, 4.1 and 7",
      "url": "https://www.snia.org/sites/default/files/SSSI/PUBLISHED%20SNIA%20SFF-TA-1042%206-2025.pdf",
      "accessed": "2026-10-19"
    }
  ],
  "updated": "2026-10-19",
  "provenance": [
    "Reviewed published Rev 1.0; later drafts are not treated as approved requirements.",
    "Status unknown concerns commercial availability, not the existence of the published specification; the specification does not establish supplier availability. [c1]",
    "The publication date is a standard milestone, not a first shipment or invention date; firstSeen remains null."
  ]
}