hesela.devE2
E2 is an EDSFF device form factor designed for vertical installation in 2U systems, with mechanical requirements defined by SFF-TA-1042.
Published Rev 1.0, dated 16 June 2025, describes a design goal of accommodating at least 64 NAND packages. This is not a required installed package count or a byte-capacity guarantee. [1]
The enclosure uses the SFF-TA-1002 card-edge interface and SFF-TA-1009 signal assignments. A latch or front plate can extend beyond the documented enclosure dimensions, so bay qualification must include those parts. [1]
The specification distinguishes 25 W initial slot power from the connector-derived 79.2 W ceiling. Host and device operating conditions further limit sustained power; cooling must satisfy the applicable host requirements. [1]
Relations
- related
- EDSFF, E1.L, E1.S, E3.S, Flash module, NAND flash
Citations
Sources & caveats
- Reviewed published Rev 1.0; later drafts are not treated as approved requirements.
- Status unknown concerns commercial availability, not the existence of the published specification; the specification does not establish supplier availability. [1]
- The publication date is a standard milestone, not a first shipment or invention date; firstSeen remains null.